Package Design Engineering - Director

Job Description

We are seeking an experienced and strategic Director of Semiconductor IC Packaging Assembly Engineering to lead assembly sustaining engineering and high-volume manufacturing operations for advanced semiconductor packaging technologies. This role supports AI/data center infrastructure power packaging applications, especially Smart Power Stages, Vertical Power Stages, Power Modules, and Discrete FET packages, with additional scope spanning wide-bandgap (WBG) technologies including SiC and GaN, DBC and AMB substrates, and advanced interconnect technologies. This leader will oversee yield performance, process stability, quality control, process change management, and manufacturing readiness while partnering closely with Package Engineering, R&D, Product Engineering, Quality, Supply Chain, and external OSAT partners to successfully transition New Product Introduction (NPI) programs into scalable high-volume manufacturing (HVM).

The ideal candidate combines deep semiconductor packaging assembly expertise with strong operational leadership, data-driven decision-making, and cross-functional collaboration skills to drive manufacturing excellence, product quality, and continuous improvement across global operations. This role also serves as a critical interface to Director, Package Engineering by ensuring package development intent, qualification requirements, process windows, and ramp readiness are translated effectively into stable, cost-competitive, high-volume manufacturing execution.

Key Responsibilities

Manufacturing & Sustaining Engineering Leadership

• Lead sustaining engineering across semiconductor package assembly technologies and product lines.
• Drive high-volume manufacturing performance in yield, cycle time, quality, throughput, and cost.
• Establish strong engineering systems for process control, defect reduction, and continuous improvement.
• Align assembly engineering roadmaps with business growth and package technology strategies.
• Partner with Package Engineering and OSAT teams to ensure manufacturable designs and robust production controls.

Yield Monitoring & Continuous Improvement

• Own assembly yield monitoring, trend analysis, and corrective action processes.
• Lead data-driven yield improvement initiatives using statistical and problem-solving methodologies.
• Resolve process, reliability, and customer quality issues through disciplined root-cause analysis.
• Define KPIs and dashboards to track manufacturing performance and engineering effectiveness.

Quality & Reliability Management

• Partner with Quality and Reliability teams to meet internal, industry, and customer standards.
• Drive containment, corrective, and preventive actions for manufacturing and field quality issues.
• Ensure process controls and qualification requirements are maintained across OSAT sites.
• Support customer, supplier, and internal quality audits and reviews.
• Work with manufacturing partners to resolve issues early and ensure shipment of qualified products.

Process Change Management

• Lead process change management for materials, equipment, tooling, flows, and sites.
• Assess engineering changes for technical, quality, reliability, supply, and operational impact.
• Lead qualification plans for transfers, second sourcing, equipment changes, and cost reductions.
• Maintain disciplined documentation, change control, and manufacturing readiness processes.

NPI to High Volume Manufacturing Ramp

• Serve as the key manufacturing engineering interface for NPI-to-production transfers.
• Drive manufacturability reviews and package-process integration during product development.
• Lead manufacturing readiness, process optimization, and structured ramp execution for new products.
• Ensure process, qualification, material, site, and capacity readiness for high-volume ramp.
• Coordinate ramp execution with cross-functional engineering, supply chain, and quality teams.

OSAT Partner Management

• Manage global OSAT and contract manufacturing relationships supporting development and production.
• Drive partner accountability for yield, quality, cycle time, reliability, and capacity.
• Lead technical reviews, audits, benchmarking, and qualification assessments for manufacturing partners.
• Collaborate with suppliers and OSAT partners on transfers, optimization, scaling, and cost improvement.

Team Leadership & Organizational Development

• Build and develop a high-performing global assembly engineering team.
• Foster a culture of accountability, collaboration, technical excellence, and continuous improvement.
• Support organizational scaling to meet evolving business and technology needs.
• Drive talent development, succession planning, and technical capability growth.
• Strengthen organizational expertise in packaging innovation to support business growth and customer adoption.

Qualifications

• Bachelor’s degree in Electrical Engineering, Materials Science, Mechanical Engineering, Chemical Engineering, or related technical discipline.
• 12+ years of semiconductor manufacturing and packaging engineering experience with significant exposure to IC assembly operations, package development, qualification, and NPI-to-HVM transfers.
• 5+ years of leadership experience managing engineering teams in semiconductor manufacturing environments.
• Strong expertise in semiconductor package assembly processes including wirebond, flip chip, wafer-level packaging, multi-chip modules, molding, singulation, SMT, and advanced packaging technologies; experience with power packaging, power SiP/modules, Smart Power Stages, Vertical Power Stages, Power Modules, Discrete FET packages, power devices, and wide-bandgap packaging such as SiC and GaN is highly valued. Knowledge of DBC, AMB, and advanced interconnect technologies is a strong plus.
• Deep understanding of semiconductor manufacturing yield analysis, SPC, DOE, reliability, process control methodologies, package/process qualification methods, and statistical analysis tools.
• Experience working with global OSAT partners and outsourced manufacturing ecosystems, including benchmarking, selection, qualification, and ongoing technical management of subcontractors and contract manufacturers.
• Proven track record of successful NPI-to-HVM product ramp execution.
• Strong knowledge of semiconductor quality systems, change management, and qualification methodologies.
• Excellent analytical, organizational, communication, and cross-functional leadership skills.

Preferred Qualifications

• Master’s degree or PhD in Engineering or related field.
• Experience with advanced packaging technologies such as 2.5D/3D packaging, SiP, fan-out, embedded die, heterogeneous integration, wafer-level packaging, multi-chip modules, advanced interconnects, and substrate technologies such as DBC and AMB.
• Familiarity with automotive, AI/data center infrastructure power, high-performance computing, power semiconductor, and wide-bandgap product manufacturing requirements.
• Experience managing geographically distributed engineering teams and global manufacturing operations.
• Knowledge of reliability standards including JEDEC, IPC, and customer qualification requirements.

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier . With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

…