TW_感測器研發_Packaging Development Engineer

Job Description

• Packaging Development Engineer for MEMS products

• Package design and process development in co-operation with supplier and product engineering team for electronic sensors.

• Develop and optimize assembly processes for MEMS in automotive and consumer-electronics acoustic applications.

• Oversee sample manufacturing and process qualification at assembly partners.

• Team work in English language with a multitude of international interfaces is mandatory.

Qualifications

• 3-8 Years experience in packaging/assembly of semiconductors components, especially familiar with LGA, BGA, DFN, WLCSP, SiP, micro-phone

• Preferred solid technical background in assembly technology. Experience with acoustic device development is a plus.

• Passion for developing technical solutions in multidisciplinary international projects

• Experience in international corporation

• Excellent English skills (verbal and written); willingness to travel as required.

• Good teamwork with multitude of international interfaces